Super Protocol | Confidential Computing for AI Agents and Apps

Memory Configuration Guide for TEE-Compliant Hardware in Intel TDX-Based Systems

This section outlines memory requirements for Intel TDX-based systems, including DIMM configuration rules, RAM allocations, and how SGX affects attestation.

Intel offers two TEEs

Intel TDX – VM-level isolation
Intel SGX – application-level isolation

While they serve different purposes, Intel SGX must be enabled in BIOS for Intel TDX attestation to work – even if SGX is not used for data processing. Without proper SGX, TDX cannot perform attestation, which is critical for proving trust to external verifiers.

Note: The requirement to enable SGX in BIOS is defined by Intel's TDX architecture itself, not by Super Protocol. While Super supports a TEE-agnostic infrastructure, TDX's reliance on SGX enclaves for attestation applies to all Intel TDX-based deployments.

This dependency imposes specific memory layout rules that must be followed during hardware configuration or procurement – ensuring proper TDX functionality and compatibility with Super Protocol, which requires TEE-compliant hardware.

Memory Allocation Rules (SGX Requirements for TDX)

To ensure TDX attestation works as expected, system memory must be configured as follows:

At least 8 DIMMs per CPU socket
Symmetric distribution across Integrated Memory Controllers (IMCs)
Slot 0 must be populated on each memory channel

These requirements apply whether the system uses TDX alone or in combination with GPU-based TEEs (e.g., NVIDIA H100, H200, Blackwell GPUs).

TDX RAM Availability: What's Reserved and What's Usable

To enable TDX attestation, a small portion of RAM must be reserved for Intel SGX – even though SGX is not used for actual workload processing.

This reserved memory, called EPC (Enclave Page Cache), is only used to run two SGX enclaves during attestation.

This is good news for infrastructure providers planning to use Intel TDX:

Only a minimal EPC segment is needed – no large RAM reservations for SGX
However, this EPC-reserved memory is not available for TDX workloads
The remaining system RAM is fully usable for confidential AI and data processing under Intel TDX

Reference Tables for TEE-Compliant Memory Configurations

The tables below list various valid memory configurations for Intel TDX-compatible servers.

While some setups may not be performance-optimal, all meet the technical requirements for TEE compliance with Intel TDX and SGX.

Bold entries indicate optimal distribution of Number of DIMMs and DIMM Size (GB). Please check with your hardware provider to confirm the latest compatibility and support status.

HGX 8-GPU Systems

Number of CPUs (Sockets)	Total RAM (GB)	Number of DIMMs	DIMM Size (GB)	TEE-compliant (Intel TDX & SGX)
2 CPUs (HGX 8-GPU)	1024	32	32	Yes
2 CPUs (HGX 8-GPU)	1536	48	32	Yes
2 CPUs (HGX 8-GPU)	2048	64	32	Yes
2 CPUs (HGX 8-GPU)	3072	96	32	Yes
2 CPUs (HGX 8-GPU)	3072	48	64	Yes
2 CPUs (HGX 8-GPU)	3072	96	32	Yes

2 CPU Systems

Number of CPUs (Sockets)	Total RAM (GB)	Number of DIMMs	DIMM Size (GB)	TEE-compliant (Intel TDX & SGX)
2 CPUs	256	16	16	Yes
2 CPUs	384	24	16	Yes
2 CPUs	512	16	32	Yes
2 CPUs	512	32	16	Yes
2 CPUs	768	24	32	Yes
2 CPUs	1024	32	32	Yes
2 CPUs	1536	48	32	Yes
2 CPUs	512	16	64	Yes
2 CPUs	1024	32	64	Yes
2 CPUs	1536	48	64	Yes
2 CPUs	2048	64	64	Yes

1 & 4 CPU Systems

Number of CPUs (Sockets)	Total RAM (GB)	Number of DIMMs	DIMM Size (GB)	TEE-compliant (Intel TDX & SGX)
1 CPU	128	8	16	Yes
1 CPU	192	12	16	Yes
1 CPU	256	16	16	Yes
4 CPUs	1024	32	32	Yes
4 CPUs	1024	32	64	Yes

Important Compliance Notes

This guide provides an overview of compatibility requirements and recommendations based on information available as of February 13, 2025.

It does not represent a comprehensive or final list of all technical requirements.

Please consult your provider to ensure that your platform complies with all relevant specifications for:

Intel TDX
Combined GPU TEE configurations
Confidential Computing deployments

Intel Official Reference

TDX Hardware Selection and Memory Requirements